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SINOPRO-The Exclusive Agency In Korea
Product:
Molybdenum Sputtering Targets
Product No.:
SP1101
Element:
Mo
Purity:
3N5
Shape:
Planar target, Rotary target
Maker:
XINK(CN)
Supplier:
SINOPRO-The Exclusive Agency In Korea

Products Process

Product Introduction

Molybdenum is a chemical element with symbol Mo and atomic number 42. In its pure form, molybdenum is a silvery-grey metal with a Mohs hardness of 5.5, and a standard atomic weight of 95.95 g/mol. It has a melting point of 2,623 °C (4,753 °F); of the naturally occurring elements, only tantalum, osmium, rhenium, tungsten, and carbon have higher melting points.It has one of the lowest coefficients of thermal expansion among commercially used metals.

 

Molybdenum has the advantages of superior electrical and thermal conductivity, small thermal expansion coefficient and strong corrosion resistance. It is mainly used in electric vacuum devices, high temperature furnace heating elements, heat insulation boards and evaporation boats, etc. For molybdenum sputtering target, it's widely used for field of TFT-LCD, thin film solar cells and semiconductor fields

 

Thanks to the special forming processes we used, our Molybdenum sputtering targets possess higher density and smaller average particle size, so that you can benefit from a faster process due to higher sputtering speeds.

The flexibility of our production process allows to adjust the microstructure of our coating material to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. The picture below are two typical micrographs of our Molybdenum sputtering target, the average grain size<100μm.

 

 

The chemical purity is crucial to a metal sputtering targets, if the purity is higher, the films you obtained possess an more outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for 3N5 high purity Molybdenum sputtering target.
Analytical Methods: 1. Metallic elements were analyzed using ICP-OES. 2. Gas elements were analyzed using LECO.