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1. High filling: Particle size distribution is reasonable, filling efficiency as resin filler is high, and compound of low viscosity and good fluidity can be made.
2. High thermal conductivity: Filling degree is high. Compared with the thermal conductivity of crystalline silicon, that of mixture is higher.
3. Low wear rate: It appears spherical. It wears less on the mixer and molding tool.
4. Electrical and moisture resistance: There is a very small content of ion impurities, such as Na and Cl, so it has good electrical and moisture resistance.
5. Particle Morphology: Equant diameter sphere, High surface smoothness.
Applications and Usages
1. Heat sink: radiating substrate filler, heat sinking oil, phase change film
2. Semiconductor filler
3. Special air abrasive
4. Organosilicon heat sinking adhesive and mixture filler
5. Ceramic filter membrane
6. Coated powder, etc.