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The highest purity of Nickel sputtering targets we produced is 99.999%, normally used in the semiconductor and microelectronics industries and are key materials for semiconductor back electrodes. Through repeated plastic processing, our nickel target has high density, high purity and uniform grain size. The picture below are two micrographs of our nickel sputtering target, the average grain size＜100μm.
The sputtering targets we produced are high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for 4N high purity Nickel sputtering target.
Analytical Methods: 1. Metallic elements were analyzed using GDMS and ICP-OES. 2. Gas elements were analyzed using LECO.